Device for measurement and analysis of electrical signals of an integrated circuit component

ABSTRACT

According to the invention, one or more external test connection contact points (pads; pins; balls), are provided in an integrated circuit component (chip) ( 1 ), through which signals ( 4, 5, 6 ) that are to be measured or analyzed are selectively fed, e.g. by means of a multiplex circuit ( 7,8 ), and wherein the signals may be connected by means of routes located internally in the component from switch points that are not directly accessible, e.g. points inside the chip ( 15  to  20 ) or covered contact points. The device according to the invention is particularly useful for highly integrated semiconductor chips.

CROSS REFERENCE TO RELATED APPLICATIONS

This is a division of application Ser. No. 09/740,634, filed Dec. 18,2000; which was a continuing application, under 35 U.S.C. §120, ofInternational application PCT/DE99/01719, filed Jun. 11, 1999; theapplication also claims the priority, under 35 U.S.C. §119, of Germanpatent application No. 198 26 825.4, filed Jun. 16, 1998; the priorapplications are herewith incorporated by reference in their entirety.

BACKGROUND OF THE INVENTION FIELD OF THE INVENTION

The invention relates to a device for electrical measurement andanalysis of electrical signals which are present at circuit points thatare not directly accessible in an integrated circuit component (IC;integrated circuit; chip) which is provided with a large number ofconnecting contact points (pads; pins; balls).

In order to allow malfunctions and clock concepts to be analyzed onintegrated circuit components, it is necessary to monitor internal-chipsignals, that is to say signals which are present at inaccessiblecircuit points within the integrated circuit component. In this case,accurate timing of the signal monitoring is very frequently important.For example, to do this, clocks must be measured with respect to oneanother, asynchronous signals such as interrupts must be measured, andfunctions must be analyzed as a function of asynchronous signals.

Previous analysis methods have used special analysis equipment which istechnically extremely complex and is therefore also very expensive. Forsuch analysis, the integrated circuit component must be opened, and mustbe prepared for the measurements. However, these measures change theelectrical response of the circuit and, in some cases, it is no longerpossible to reproduce faults.

Inaccessible circuit points can also result from the definition anddesign of integrated circuit components. When, for example, integratedcircuits are mounted in the new, so-called BGA (ball grid array)packages, and are then mounted on a system board in the system, then thecontact points (balls) on the BGA package are no longer accessible tothe system board since the contact points are located on the lower faceof the package and are thus concealed between the package and the systemboard. It is thus no longer possible to tap off the signals at thecontact points for analysis and test purposes.

This problem does not occur, for example, when TQPF packages are usedfor integrated semiconductor circuits, since the signals can also betapped off directly at the pins in the system.

In the case of BGA packages, on the other hand, the most importantsignals are routed to test points on the system board, and are routedfrom there to the connected chip. First, this costs space on therespective system board, and this is necessarily associated withadditional costs, and, second, it results in additional complexity forsignal extraction, for which the corresponding signals must first berouted to the surface of the printed circuit board, which in some casesis a multilayer board. For these reasons, only a very small number ofsignals are routed to test points, which means that, in the event of afault, it is often impossible to tap off just the desired signal.

SUMMARY OF THE INVENTION

It is accordingly an object of the invention to provide an apparatusproviding a technically less complex solution for allowing those signalswhich are present at inaccessible circuit points in an integratedcircuit component, for example internal-chip signals or all the signals,to be monitored at the contact points of an integrated semiconductorcircuit which is enclosed in a BGA package, so that tests and analysiscan be carried out easily even in mass-produced products that havebecome well known.

With the foregoing and other objects in view there is provided, inaccordance with the invention an integrated circuit component thatincludes a plurality of connecting contact points; a plurality ofcircuit points that are not externally accessible and that provideelectrical signals to be measured or analyzed; and at least one externaltest connecting contact point to which the signals to be measured oranalyzed can be selectively applied such that the signals can be can bepassed on via routes within the integrated circuit component from saidplurality of circuit points that are not externally accessible.

The use of external test connecting contact points allow internal chipsignals to be seen and the timing to be determined accurately. For thispurpose, a reference signal is selectively applied such that it can bepassed on via a route within the component to one of the external testconnecting contact points from a circuit point which is not externallyaccessible, and in that signals which are to be measured or are to beanalyzed can in each case be selectively applied such that they can bepassed on via routes within the component to the other test connectingcontact points from circuit points which are not externally accessible.

The reference signal is thus made available in addition to the signal tobe analyzed, in order to determine the signal response in the timedomain. In order to allow internal-chip signals such as clock signalsand asynchronous signals to be analyzed with accurate timing, at leasttwo external test connecting contact points are thus provided accordingto the invention.

The inaccessible signals may thus be internal chip signals in theintegrated circuit component, which is designed such that these signals,including the reference signals, can be selectively passed on to theexternal test connecting contact points.

However, the inaccessible signals may also be signals which occur atinaccessible contact points in the package of an integrated circuitcomponent, in which case these signals, including reference signals areselectively passed on to the test connecting contact points, which areformed by particular ones of the contact points.

In this case, the integrated circuit component package is, inparticular, a so-called BGA package (ball grid array package), in whichthose test connecting contact points which are provided by contactpoints (balls) are inaccessible, since the contact points are located onthe lower face of the package and are thus concealed between the packageand a system board on which the package is fitted. In this case thespecial contact points to which those signals which are to be measuredand are to be analyzed, as well as the reference signals, which arelikewise present at other contact points, are selectively passed on, andare electrically conductively connected to a corresponding number ofmetallic test points on the system board.

One or more contact points are thus defined in the BGA package, whosesignals are seen at test points on the customer-specific system board.The signals from all the other contact points in the integrated circuitcomponent can be seen at these contact points.

In accordance with an added feature of the invention, a time-controlledmultiplexing circuit is provided for selectively passing on signals inthe integrated circuit component. The multiplexing circuit enables thevarious signals which are to be measured and are to be analyzed and, ifappropriate, the respective reference signals, to be passed on to theexternal test connecting contact points. If the time-controlledmultiplexing circuit is provided in an integrated circuit componentsurrounded by a BGA package, then those contact points which are notused as test connecting contact points are electrically conductivelyconnected to inputs of the multiplexing circuit, whose outputs areelectrically conductively connected to those particular contact pointsin the BGA package which form the external test connecting contactpoints. All the contact point signals can then be multiplexed asrequired to the specific test contact points. In the past, one signalhas always been uniquely associated with one contact point, or with avery small number of contact points.

In accordance with an additional feature of the invention, the controlof the multiplexing circuit, which predetermines the selective passingon of signals to the test connecting contact points, is programmable.This allows the multiplexing circuit to be programmed as required, evenduring operation.

In accordance with another feature of the invention, a component tester,can be used to analyze the integrated circuit component, and to whichthose signals which are respectively present at the test connectingcontact points are applied for analysis.

In accordance with a further feature of the invention, the integratedcircuit component can be directly analyzed in an application within asystem, in which the signals which are present at the test connectingcontact points are measured and analyzed. In this case, it is alsopossible to analyze the system in which the integrated circuit componentis used.

In accordance with another added feature of the invention, the testconnecting contact points can also be used in the opposite operatingdirection for inputting signals to those circuit points which are notexternally accessible in the integrated circuit component (input mode).

With the foregoing and other objects in view there is provided, inaccordance with the invention, an integrated circuit component thatincludes a package; a plurality of contact points for connection to anexternal component and disposed on said package; a test contact pointfor connection to the external component and disposed on said package;and a multiplexer having an output connected to said test contact pointand having a plurality of inputs, each one of said plurality of inputsconnected to a respective one of said plurality of contact points.

Other features which are considered as characteristic for the inventionare set forth in the appended claims.

Although the invention is illustrated and described herein as embodiedin a device for measurement and analysis of electrical signals of anintegrated circuit component, it is nevertheless not intended to belimited to the details shown, since various modifications and structuralchanges may be made therein without departing from the spirit of theinvention and within the scope and range of equivalents of the claims.

The construction and method of operation of the invention, however,together with additional objects and advantages thereof will be bestunderstood from the following description of specific embodiments whenread in connection with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a schematic illustration of an integrated electricalsemiconductor circuit component (chip) having two external testconnecting contact points (pins) via which the internal chip signals canbe monitored;

FIG. 2 shows, likewise schematically, an illustration of an electricalsemiconductor chip having two external test pads, via which signals fromother pads, which are inaccessible after installation, in BGA packagecan be monitored;

FIG. 3 shows a schematic view of electrical semiconductor chips mountedin a BGA package in an overall system; and

FIGS. 4 a, 4 b and 4 c respectively show a view from underneath, fromthe side and from above a BGA package (plastic thin flat ball gridarray).

DESCRIPTION OF THE PREFERRED EMBODIMENTS

Referring now to the figures of the drawing in detail and first,particularly, to FIG. 1 thereof, there is schematically shown anintegrated semiconductor circuit component (chip) 1. The integratedsemiconductor circuit component 1 has two external test connectingcontact points (pins) 2 and 3 via which internal-chip signals 4, 5 and 6can be monitored with accurate timing, that is to say signals which arepresent at circuit points that are not directly accessible. For example,clocks can be measured with respect to one another, asynchronous signalssuch as interrupts can be measured, or functions can be analyzed as afunction of asynchronous signals. The integrated circuit component 1therefore has two external connecting contact points 2 and 3, since thegoal is to determine the timing accurately.

For such a determination process, in addition to the signal to beanalyzed, at one of the test connecting contact points 2 and 3, areference signal is available at the respective other test connectingcontact point. It follows from this that there must be at least two testconnecting contact points 2 and 3 for internal-chip signals 4, 5 and 6to be analyzed with accurate timing. Two multiplexers 7 and 8 areprovided as a multiplexing circuit for selectively passing on theinternal chip signals 4, 5 or 6, and their inputs 9, 10, 11 and 12, 13,14, respectively, are connected to the internal-chip points 15, 16, 17and 18, 19, 20, respectively, which carry the signals. The outputs 21and 22 of the two multiplexers 7 and 8, respectively, are electricallyconnected to the two external test connecting contact points (pins) 2and 3, respectively.

The process of passing on the signals from the two multiplexers 7 and 8which may, for example, be logic devices or tristate devices, is in eachcase controlled by a control register 23 or 24, respectively, which canbe programmed via a controller, a digital signal processor or a tapcontroller during operation.

FIG. 2 shows, likewise schematically, an integrated electricalsemiconductor circuit component (chip) 25 having two test contact points(test pads; test balls) 26 and 27 which form external test connectingcontact points, via which the signals from other contact points (pads;balls) 28, which are not accessible after installation, in a BGA packagecan be monitored. As shown in three different views in FIGS. 4 a, 4 band 4 c, the contact points 28 to the system board 29 are notaccessible, since the contact points 28 are located on the lower face ofthe package 30, and are thus concealed between the housing 30 and thesystem board 29.

The signals can thus not be tapped off at the contact points 28 for testand analysis purposes. As shown in FIG. 2, a multiplexing circuit 31 isprovided for selectively passing on the signals which are present at thecontact points 28, and its inputs 32 are connected to the individualcontact points 28.

The outputs 33 and 34 of the multiplexing circuit 31 are electricallyconnected to the two external test contact points (test balls) 26 and27, respectively. The process of passing on the signals from themultiplexing circuit 31 which, for example, may be in the form of alogic device or tristate device, is controlled by a control register 35,which can be programmed via a controller, a digital signal processor ora tap controller during operation.

FIG. 3 shows a schematic view of integrated semiconductor circuitcomponents 36 and 37 which are each mounted in a BGA package in anoverall system, which is fitted on a customer-specific system board 38.Two metallic test points 39 and 40 are fitted on the system board 38,and are electrically connected to the two test contact points 26 and 27.The signals from the two balls, which are defined as test contact points26 and 27, in the integrated semiconductor circuit component 36 can beseen at the two test points 39 and 40 on the system board 38.

The signals from all the other contact points 28 in the integratedcircuit component 36 can be seen at these two contact points 26 and 27,and thus at the test points 39 and 40. The process of selectivelypassing on the individual signals in a controlled manner from all thecontact points 28 to the test contact points 26 and 27, respectively, iscarried out, as shown in FIG. 1, by means of the multiplexing circuit31.

1. An integrated circuit component, comprising: a package; a pluralityof contact points for connection to an external component and disposedon said package; a test contact point for connection to the externalcomponent and disposed on said package; and a multiplexer having anoutput connected to said test contact point and having a plurality ofinputs, each one of said plurality of inputs connected to a respectiveone of said plurality of contact points.
 2. The integrated circuitaccording to claim 1, comprising: a first set of contact points definedby said plurality of contact points; a second set of contact points forconnection to an external component and disposed on said package; afirst test contact point defined by said test contact point; a secondtest contact point for connection to the external component and disposedon said package; a first multiplexer defined by said multiplexer, eachone of said plurality of inputs connected to a respective one of saidfirst set of said plurality of contact points; and a second multiplexerhaving an output connected to said second test contact point and havinga plurality of inputs, each one of said plurality of inputs of saidsecond multiplexer connected to a respective one of said second set ofcontact points.
 3. The integrated circuit according to claim 1, whereinsaid package is a ball grid array package.